![]() Datacon 2200 Bonder (flip chip process).By clicking Sign In, I will check the data entered to pass our security cretentials.It can be operated by seating personnel for best performance of the manual. Find all the manufacturers of die bonders and.The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.2200 evo plus Future Proof Equipment Innovative Solution for Innovative Products The 2200 evoplus die bonder for Advanced Packaging assembles all kinds of.Datacon 2200 evo 1) High accuracy and multi function: The assembly precision up to + 10 (optional up to 7 m) Low loss, high capacity One machine can. ![]() The Datacon 2200 evo series of multi-module die attach machines from BESI, tends to applications on die attach and clip chips that need utmost versatility.Why CAE Leadership Contact Us Our Principles Careers. ![]() In January 2016, Micro Point Pro (MPP) acquired Kulicke and Soffa's manual wire bonder business unit.
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